Heat transfer plastic sheet developed in Japan

2022-07-29
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In recent years, with the development of electronic machines to high-performance, miniaturization, lightweight and high-density, it has led to the high-density preparation of semiconductor devices, resulting in the heating and heat dissipation problems of electronic machines. Wiring substrates can be made of metal, aluminum and other materials, or various methods such as fans can be used to dissipate heat from exothermic parts

according to the requirements of the above-mentioned heat dissipation parts, Japan ポリマテツケケケケケケケケケケケケケケケケケケケケリママテツケケケ124; ② The density is 1.14g/cm3; Lighter than aluminum 3.7g/cm3; ③ The linear swelling coefficient is - 8ppm K. Aluminum ratio 7.7ppm K low; ④ The dielectric constant is 2.91 and the volume resistance is> 1012 Ω cm。 Heat transfer in a very cold winter as early as 1930, the principle of heat conduction mainly used special organic fibers to add to the bad oxygen wood grease, and the maximum amount added reached 58% of the volume. The arrangement direction of the added special organic fibers in the epoxy resin is the sheet thickness direction, that is, the z-axis direction. The addition amount can be based on the performance requirements put forward by users, but in general, it can be used to obtain composite materials with different properties. For example, the heat to further improve the performance of the car in all aspects. The conduction performance can reach 26w/m.k at most and 0.3w/m.k at least.

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